MULTIVAC is displaying its X-Line Thermoform Packaging Machine, along with a variety of packaging equipment aimed at the food packaging industries, in booth S-2514 at PACK EXPO 2018, Oct. 14-17 at McCormick Place in Chicago.
X-Line High-Speed Thermoform Packaging Machine
The MULTIVAC X-Line offers maximum packaging reliability, even more consistent pack quality and a higher level of process speed, as well as operation that is easier and more reliable than ever before. Thanks to seamless digitalization, a comprehensive sensor system and networking with the MULTIVAC Cloud and Smart Services, the X-line redefines thermoform packaging and sets new standards in the market.