Festo Corporation will sponsor Clemson University's "Data-Driven Packaging Design" exhibit at PACK EXPO International 2018 and co-located Healthcare Packaging EXPO (Oct. 14–17; McCormick Place, Chicago), according to show producer PMMI, The Association for Packaging and Processing Technologies. Clemson’s interactive exhibit in North Hall, Booth N-4543 will provide insight on leveraging data to develop award-winning packaging.
“Festo is proud to sponsor this exciting exhibit,” says Richard J. Huss, president, Festo US. “The virtual reality and eye-tracking demonstrations offer an immersive look at how packaging allows consumers to interact with brands using cutting-edge technology. We’re glad to be involved in connecting show attendees to the latest technological innovations and give Clemson students a platform like PACK EXPO International.”