Festo Corporation will sponsor Clemson University's "Data-Driven Packaging Design" exhibit at PACK EXPO International 2018 and co-located Healthcare Packaging EXPO (Oct. 14–17; McCormick Place, Chicago), according to show producer PMMI, The Association for Packaging and Processing Technologies. Clemson’s interactive exhibit in North Hall, Booth N-4543 will provide insight on leveraging data to develop award-winning packaging.

“Festo is proud to sponsor this exciting exhibit,” says Richard J. Huss, president, Festo US. “The virtual reality and eye-tracking demonstrations offer an immersive look at how packaging allows consumers to interact with brands using cutting-edge technology. We’re glad to be involved in connecting show attendees to the latest technological innovations and give Clemson students a platform like PACK EXPO International.”

The Clemson exhibit will include virtual reality demonstrations, eye tracking and emotional analytics studies. Clemson University offers a renowned packaging science degree program and is home to leading experts on packaging and its effects on people.

“Every year this exhibit really shows the talent and promise of the next generation workforce,” says Jim Pittas, president and CEO, PMMI. “The virtual reality demonstrations continue to be an attendee favorite at the show, and we’re looking forward to what’s in store at their exhibit this year.”

Registration is open for PACK EXPO International and Healthcare Packaging EXPO at packexpointernational.com and hcpechicago.com. Registration costs $30 until Friday, Sept. 28, after which time it increases to $100.

Source: PMMI