PACK Challenge, a brand-new packaging competition, will bring six high school teams together for a head-to-head machine-building challenge at PACK EXPO International (Oct. 23–26; McCormick Place, Chicago), according to show producer, PMMI, The Association for Packaging and Processing Technologies.
“We are excited to introduce this first-of-its-kind competition and watch the students roll up their sleeves in a real-world application while they learn,” says Jim Pittas, president a & CEO, PMMI. “One of our main priorities is getting students involved at a young age and showing them the doors the manufacturing industry can open. This competition will give them first-hand experience of what a career in manufacturing could look like.”