The PMMI Foundation, a part of PMMI, The Association for Packaging and Processing Technologies, awards six $5,000 PACK EXPO scholarships to students from PMMI Education Partner schools. To qualify for the PACK EXPO scholarship, students must be enrolled at an Education Partner, major in engineering, packaging, processing, mechatronics or a related field and must demonstrate a financial need.
“This scholarship program shows how PMMI invests in the future packaging workforce,” says Jim Pittas, president and CEO, PMMI. "We are proud that through the PACK EXPO portfolio of trade shows and the PACK EXPO Scholarship program we are able to invest in the future of the packaging and processing community."