New packaging technologies take stage at Process Expo
The Food Processing Suppliers Association (FPSA) announced an important addition to the packaging track of the PROCESS EXPO UNIVERSITY educational program taking place at Chicago's McCormick Place from November 3-6, 2013. Packaging in the New Millennium will be held on the PROCESS EXPO show floor on Monday, November 4th and Tuesday, November 5th. This thought-provoking session will be divided over two days and feature panels of packaging professionals from some of the food industry’s leading processors, sharing the latest innovations in food and beverage packaging and their vision for future packaging trends.
PROCESS EXPO UNIVERSITY’s packaging track will feature speakers from Michigan State University and Ohio State University, covering critical topics such as Applications of Bio-Based Materials in Food Packaging, Defining Food Fraud and Choosing Countermeasures, Active Packaging Technologies, Labeling Claims and Basic Nutritional Labeling. Admission to all PROCESS EXPO UNIVERSITY sessions is free of charge to all registered attendees.